Fudan Microelectronics: FPAI chip has completed tape-out testing and is preparing for commercialization

Mars Finance News April 2, according to a report, Fudan Microelectronics released an announcement of an investor relations activity record form. The company disclosed that its FPAI chips have built an heterogeneous integrated intelligent chip design and application development software platform, and laid out a product lineage from 4TOPS to 128TOPS. Among them, the promotion progress of the company’s first 32TOPS computing power chip is going well; the 8TOPS and 128TOPS computing power chips have respectively completed tape-out and testing, and are preparing for productization. The company’s FPAI chip process technology covers 1xnm FinFET advanced processes and mature processes; it integrates SoC, FPGA, and NPU into one package, targeting customized edge and fused-end inference applications. In addition, the company launched the RF-FPGA and RFSOC series products, integrating RFADDA technology at the 1xnm node. In 2025, the FPGA product line is expected to achieve sales revenue of about 1.316 billion yuan, with approximately 1.2 billion yuan contributed by the high-reliability sector. The company’s operating performance in the first quarter was solid, maintaining a steady year-over-year growth trend; its new business and new customers are being actively expanded. (Company announcement)